it has been formulated for the application to protect structure model of photo device. it can cure fast at low temperature.
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it has been formulated for the application to protect structure model of photo device. it can cure fast at low temperature.。
single component；
low moisture absorption rate, high tg；
good adhesion on plastic materials.
the data above indicate typical values only and are not intended to be used as specification limits.
bonotec products are packaged in syringes or jars per customer specification. available package sizes range from 1cc to 30cc and 1 ounce to 1 pound. for details, refer to the bonotec standard package data set or consult your customer service representative.
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