exbond 5050uv-凯发k8国际首页登录

contact us

can't find what you're looking for?submit your questions

online message

exbond 5050uv

designed specifically for optoelectronic devices encapsulation adhesive with precuring...

86-021-52272688

contact us
product introduction

product description

designed specifically for optoelectronic devices encapsulation adhesive with precuring...

features

single component;
uv or heat cure;

technical parameters

  • typical uncured properties
  • appearance
  • viscosity @25℃
  • thixotropic index
  • storage life
  • exbond 5050uv
  • yellow paste
  • 4k cp
  • >3
  • 1year
  • test description
  •  
  • brookfield cp51@5rpm, 25℃
  • viscosity@0.5rpm/viscosity@5rpm
  • -20℃, non light
  • cure process data
  • recommend cure condition
  • optional cure condition
  • exbond 5050uv
  • uv or heat cure
  • 1hour@150℃
  • test description
  •  
  •  
  • physiochemical properties -post cure
  • solids content
  • glass transition temperature (tg)
  • coefficient of thermal expansion
  • ionics
  • hardness
  • water absorption
  • exbond 5050uv
  • 100%
  • 120℃
  • tg 以下  70 ppm/℃
    tg 以上  150 ppm/℃
  • chloride<50ppm，sodium<20ppm
    potassium<20ppm            
  • 80 d
  • 0.85 wt%
  • test description
  • n/a
  • tma penetration mode
  • tma expansion mode
  • teflon flask 5g sample / 20-40 mesh 50g di water 100℃ for 24 hours
  • shore durometer,d
  • boiling water@2 hours

the data above indicate typical values only and are not intended to be used as specification limits.

bonotec products are packaged in syringes or jars per customer specification. available package sizes range from 1cc to 30cc and 1 ounce to 1 pound. for details, refer to the bonotec standard package data set or consult your customer service representative.

©2020 bonotec electronic materials co.ltd. all rights reserved.   "));

site map

|

legal notices

网站地图